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authorPunit Agrawal <punit.agrawal@arm.com>2014-06-03 10:59:58 +0100
committerChanho Park <chanho61.park@samsung.com>2014-11-18 12:00:53 +0900
commit7fa9b68a0ae602287dbbe161f89b4adf23d5a53d (patch)
tree1206a6bf2df5f5b9d995d196ad2eb8ec50535236
parent4a982dba2ab325c74673190c3225f22ffbf6f6b6 (diff)
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thermal: Bind cooling devices with the correct arguments
When binding cooling devices to thermal zones created from the device tree the minimum and maximum cooling states are in the wrong order leading to failure to bind. Fix the order of cooling states in the call to thermal_zone_bind_cooling_device to fix this. Change-Id: I63c72736ca26ff5dd1cd9e051721c4c7f3d63af5 Cc:Zhang Rui <rui.zhang@intel.com> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com> Reviewed-by: Stephen Boyd <sboyd@codeaurora.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
-rw-r--r--drivers/thermal/of-thermal.c4
1 files changed, 2 insertions, 2 deletions
diff --git a/drivers/thermal/of-thermal.c b/drivers/thermal/of-thermal.c
index a95ee2889b1..4b2b999b761 100644
--- a/drivers/thermal/of-thermal.c
+++ b/drivers/thermal/of-thermal.c
@@ -156,8 +156,8 @@ static int of_thermal_bind(struct thermal_zone_device *thermal,
ret = thermal_zone_bind_cooling_device(thermal,
tbp->trip_id, cdev,
- tbp->min,
- tbp->max);
+ tbp->max,
+ tbp->min);
if (ret)
return ret;
}