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| author | Seung-Woo Kim <sw0312.kim@samsung.com> | 2019-11-01 10:17:15 +0900 |
|---|---|---|
| committer | Seung-Woo Kim <sw0312.kim@samsung.com> | 2019-11-01 10:17:18 +0900 |
| commit | ef61d801e04a689bc27a50846d0d3ab5a2758045 (patch) | |
| tree | 543d1e16f967eca8d036a81d322ba305123978fe | |
| parent | 1a421866df009aa6c06fb860891a85ae92c32a72 (diff) | |
| download | linux-rpi3-ef61d801e04a689bc27a50846d0d3ab5a2758045.tar.gz linux-rpi3-ef61d801e04a689bc27a50846d0d3ab5a2758045.tar.bz2 linux-rpi3-ef61d801e04a689bc27a50846d0d3ab5a2758045.zip | |
packaging: replace -fPIC to -fPIE for perf executablesubmit/tizen/20191101.065513accepted/tizen/unified/20191104.010844
Build issue for perf is from linking perf executable, so pie flag
is suitabler than pic flag. Replace -fPIC to -fPIE for perf
executable and add the flag to missed perf install part.
Change-Id: I0911dc2b3ffc54724927846f5e081da9d7335c39
Suggested-by: Dongkyun Son <dongkyun.s@samsung.com>
Signed-off-by: Seung-Woo Kim <sw0312.kim@samsung.com>
| -rw-r--r-- | packaging/linux-rpi3.spec | 4 |
1 files changed, 2 insertions, 2 deletions
diff --git a/packaging/linux-rpi3.spec b/packaging/linux-rpi3.spec index 71a40a51792e..a103e18b3a4c 100644 --- a/packaging/linux-rpi3.spec +++ b/packaging/linux-rpi3.spec @@ -97,7 +97,7 @@ make modules %{?_smp_mflags} # 1-5. Build perf make -s -C tools/lib/traceevent %{?_smp_mflags} -make -s -C tools/perf EXTRA_CFLAGS=-fPIC %{?_smp_mflags} +make -s -C tools/perf EXTRA_CFLAGS="-fPIE -rdynamic" %{?_smp_mflags} %install QA_SKIP_BUILD_ROOT="DO_NOT_WANT"; export QA_SKIP_BUILD_ROOT @@ -131,7 +131,7 @@ install -m 644 rpi3/boot/fixup*.dat %{buildroot}/boot/ # 2-5. Install perf install -d %{buildroot}/usr -make -s -C tools/perf DESTDIR=%{buildroot}/usr install +make -s -C tools/perf EXTRA_CFLAGS="-fPIE -rdynamic" DESTDIR=%{buildroot}/usr install rm -rf %{buildroot}/usr/etc rm -rf %{buildroot}/usr/lib/debug rm -rf %{buildroot}/usr/share |