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| author | Seung-Woo Kim <sw0312.kim@samsung.com> | 2018-03-27 11:27:42 +0900 |
|---|---|---|
| committer | Seung-Woo Kim <sw0312.kim@samsung.com> | 2018-03-27 11:27:44 +0900 |
| commit | efaeee04c2006fb1b6af731c50dbb82f173202b0 (patch) | |
| tree | 5f8316ab85d894db6afb60cd69cf0bb7cbf3ac2d | |
| parent | 313865c3f8bedffaede569ec5ed0d864404c4ed9 (diff) | |
| download | linux-rpi3-efaeee04c2006fb1b6af731c50dbb82f173202b0.tar.gz linux-rpi3-efaeee04c2006fb1b6af731c50dbb82f173202b0.tar.bz2 linux-rpi3-efaeee04c2006fb1b6af731c50dbb82f173202b0.zip | |
packaging: Rename spec file without arch namesubmit/tizen/20180328.044159accepted/tizen/unified/20180329.150136
In addition to arm64 arch, packaging is done also for armv7l.
Rename spec file without arch name.
Change-Id: Ie507604fb68916a7ac4da73835db706e70fff4a2
Signed-off-by: Seung-Woo Kim <sw0312.kim@samsung.com>
| -rw-r--r-- | packaging/linux-rpi3.spec (renamed from packaging/linux-rpi3-arm64.spec) | 0 |
1 files changed, 0 insertions, 0 deletions
diff --git a/packaging/linux-rpi3-arm64.spec b/packaging/linux-rpi3.spec index 0be68a5190e5..0be68a5190e5 100644 --- a/packaging/linux-rpi3-arm64.spec +++ b/packaging/linux-rpi3.spec |