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authorPunit Agrawal <punit.agrawal@arm.com>2014-06-03 10:59:58 +0100
committerChanho Park <chanho61.park@samsung.com>2014-11-18 12:00:53 +0900
commit7fa9b68a0ae602287dbbe161f89b4adf23d5a53d (patch)
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thermal: Bind cooling devices with the correct arguments
When binding cooling devices to thermal zones created from the device tree the minimum and maximum cooling states are in the wrong order leading to failure to bind. Fix the order of cooling states in the call to thermal_zone_bind_cooling_device to fix this. Change-Id: I63c72736ca26ff5dd1cd9e051721c4c7f3d63af5 Cc:Zhang Rui <rui.zhang@intel.com> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com> Reviewed-by: Stephen Boyd <sboyd@codeaurora.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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