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authorPunit Agrawal <punit.agrawal@arm.com>2014-06-03 10:59:58 +0100
committerJonghwa Lee <jonghwa3.lee@samsung.com>2014-10-08 11:16:15 +0900
commit2c1935a7defd9afaaa4f7764c5c206d043d5a850 (patch)
tree39667f39eb043234945d2638dc9f4fc3ec17b797
parentcb1ac5c60a53896a63c1a3ff1d3bb74fc5e24664 (diff)
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thermal: Bind cooling devices with the correct arguments
When binding cooling devices to thermal zones created from the device tree the minimum and maximum cooling states are in the wrong order leading to failure to bind. Fix the order of cooling states in the call to thermal_zone_bind_cooling_device to fix this. Change-Id: I63c72736ca26ff5dd1cd9e051721c4c7f3d63af5 Cc:Zhang Rui <rui.zhang@intel.com> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com> Reviewed-by: Stephen Boyd <sboyd@codeaurora.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
-rw-r--r--drivers/thermal/of-thermal.c4
1 files changed, 2 insertions, 2 deletions
diff --git a/drivers/thermal/of-thermal.c b/drivers/thermal/of-thermal.c
index a95ee2889b1..4b2b999b761 100644
--- a/drivers/thermal/of-thermal.c
+++ b/drivers/thermal/of-thermal.c
@@ -156,8 +156,8 @@ static int of_thermal_bind(struct thermal_zone_device *thermal,
ret = thermal_zone_bind_cooling_device(thermal,
tbp->trip_id, cdev,
- tbp->min,
- tbp->max);
+ tbp->max,
+ tbp->min);
if (ret)
return ret;
}