Age | Commit message (Collapse) | Author | Files | Lines | |
---|---|---|---|---|---|
2014-12-01 | Merge from TIZEN 2.3HEADtizen | Mun, Gwan-gyeong | 1 | -0/+22 | |
Apply build option to tizen 3.0 Change-Id: Ic55982288f90505a53ed04a91a25421837d66d27 | |||||
2013-10-27 | Rest e17-data SMACK label to floor and move manifest to packagingsubmit/tizen/20131219.022238submit/tizen/20131031.071257accepted/tizen/ivi/20131219.023546accepted/tizen/generic/20140106.150428accepted/tizen/20131112.015111accepted/tizen/20131031.171900accepted/tizen/20131031.112544accepted/tizen/mobileaccepted/tizen/iviaccepted/tizen/generic | Chengwei Yang | 1 | -5/+0 | |
At current stage, very early in Tizen 3.0, we're resetting all the packages SMACK label to floor, and will redefine them. In another hand, SMACK .mainfest is part of packaging now, so move them into packaging directory. Change-Id: Ida346c69be9ba012984d0b10b2882325663e417b Signed-off-by: Chengwei Yang <chengwei.yang@intel.com> | |||||
2013-06-07 | reset to floor domainsubmit/tizen/20130607.205238accepted/tizen/20130608.041145 | Anas Nashif | 1 | -17/+3 | |
2013-04-22 | Tizen 2.1 release | Jinkun Jang | 1 | -0/+19 | |