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2014-12-01Merge from TIZEN 2.3HEADtizenMun, Gwan-gyeong1-0/+22
Apply build option to tizen 3.0 Change-Id: Ic55982288f90505a53ed04a91a25421837d66d27
2013-10-27Rest e17-data SMACK label to floor and move manifest to packagingsubmit/tizen/20131219.022238submit/tizen/20131031.071257accepted/tizen/ivi/20131219.023546accepted/tizen/generic/20140106.150428accepted/tizen/20131112.015111accepted/tizen/20131031.171900accepted/tizen/20131031.112544accepted/tizen/mobileaccepted/tizen/iviaccepted/tizen/genericChengwei Yang1-5/+0
At current stage, very early in Tizen 3.0, we're resetting all the packages SMACK label to floor, and will redefine them. In another hand, SMACK .mainfest is part of packaging now, so move them into packaging directory. Change-Id: Ida346c69be9ba012984d0b10b2882325663e417b Signed-off-by: Chengwei Yang <chengwei.yang@intel.com>
2013-06-07reset to floor domainsubmit/tizen/20130607.205238accepted/tizen/20130608.041145Anas Nashif1-17/+3
2013-04-22Tizen 2.1 releaseJinkun Jang1-0/+19