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authorChengwei Yang <chengwei.yang@intel.com>2013-10-27 10:11:59 +0800
committerChengwei Yang <chengwei.yang@intel.com>2013-10-27 10:11:59 +0800
commit9bda15f306b39c61376a632cc8e94740b8041128 (patch)
tree60b48bcb4a1b66d6626296b9b8259a529c9f271e /packaging/e17.manifest
parentf36e7829b26f503f0a39175b8e460b4ec217e3c2 (diff)
downloade17-accepted/tizen/generic.tar.gz
e17-accepted/tizen/generic.tar.bz2
e17-accepted/tizen/generic.zip
At current stage, very early in Tizen 3.0, we're resetting all the packages SMACK label to floor, and will redefine them. In another hand, SMACK .mainfest is part of packaging now, so move them into packaging directory. Change-Id: Ida346c69be9ba012984d0b10b2882325663e417b Signed-off-by: Chengwei Yang <chengwei.yang@intel.com>
Diffstat (limited to 'packaging/e17.manifest')
-rw-r--r--packaging/e17.manifest5
1 files changed, 5 insertions, 0 deletions
diff --git a/packaging/e17.manifest b/packaging/e17.manifest
new file mode 100644
index 0000000..f5a44ec
--- /dev/null
+++ b/packaging/e17.manifest
@@ -0,0 +1,5 @@
+<manifest>
+ <request>
+ <domain name="_"/>
+ </request>
+</manifest>